- Maximum size:570*650mm
- Maximum thickness:10mm
- Thickness tolerance:±5%
- Hole stacking times:3
- Maximum number of pressing:4(including HDI)
- Flatness (DUT area):50μm
- Signal rate: 112G PAM4/65G NRZ
- Maximum number of layers:>100层
- BGA DUT Pitch(minimum):0.35mm